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  ICS9DBL411 idt tm /ics tm four output differential buffer for pci express 1250a?07/31/07 four output differential fanout buffer for pci express gen 1 & 2 1 datasheet stop logic dif_int dif_inc dif_lpr(3:0) 4 oe#(3:0) 4 recommended application: features/benefits: pci-express fanout buffer ? low power differential fanout buffer for pci- express and cpu clocks  20-pin mlf or tssop packaging output features:  4 - low power differential output pairs  individual oe# control of each output pair general description: the ICS9DBL411 is a 4 output lower power differential buffer. each output has its own oe# pin. it has a maximum input frequency of 400 mhz. funtional block diagram power groups vdd gnd 9,18 10,17 dif(3:0) 4 5 analog vdd & gnd description pin number (tssop) vdd gnd 6,15 7,14 dif(3:0) 1 2 analog vdd & gnd pin number (mlf) description key specifications:  output cycle-cycle jitter < 25ps additive  output to output skew: < 50ps
idt tm /ics tm four output differential buffer for pci express 1250a?07/31/07 advance information ICS9DBL411 four output differential buffer for pci express 2 pin configuration 20-pin mlf dif_int dif_inc oe0# dif0t_lpr dif0c_lpr 20 19 18 17 16 vdda 1 15 vdd_io gnda 2 14 gnd oe3# 3 13 oe1# dif3c_lpr 4 12 dif1t_lpr dif3t_lpr 5 11 dif1c_lpr 678910 vdd_io gnd dif2c_lpr dif2t_lpr oe2# 9dbl411 oe0# 1 20 dif0t_lpr dif_inc 2 19 dif0c_lpr dif_int 3 18 vdd_io vdda 4 17 gnd gnda 5 16 oe1# oe3# 6 15 dif1t_lpr dif3c_lpr 7 14 dif1c_lpr dif3t_lpr 8 13 oe2# vdd_io 9 12 dif2t_lpr gnd 10 11 dif2c_lpr ICS9DBL411 20-pin tssop
idt tm /ics tm four output differential buffer for pci express 1250a?07/31/07 advance information ICS9DBL411 four output differential buffer for pci express 3 tssop pin description pin # (tssop) pin name pin type description 1oe0# in output enable for dif0 output. control is as follows: 0 = enabled, 1 = low-low 2 dif_inc in complement side of differential input clock 3 dif_int in true side of differential input clock 4 vdda pwr 3.3v power for the analog core 5 gnda gnd ground for the analog core 6oe3# in output enable for dif3 output. control is as follows: 0 = enabled, 1 = low-low 7 dif3c_lpr out complement clock of low power differential clock pair. (no 50ohm shunt resistor to gnd needed) 8 dif3t_lpr out true clock of low power differential clock pair. (no 50ohm shunt resistor to gnd needed) 9 vdd_io pwr power supply for low power differential outputs, nominal 1.05v to 3.3v 10 gnd gnd ground pin 11 dif2c_lpr out complement clock of low power differential clock pair. (no 50ohm shunt resistor to gnd needed) 12 dif2t_lpr out true clock of low power differential clock pair. (no 50ohm shunt resistor to gnd needed) 13 oe2# in output enable for dif2 output. control is as follows: 0 = enabled, 1 = low-low 14 dif1c_lpr out complement clock of low power differential clock pair. (no 50ohm shunt resistor to gnd needed) 15 dif1t_lpr out true clock of low power differential clock pair. (no 50ohm shunt resistor to gnd needed) 16 oe1# in output enable for dif1 output. control is as follows: 0 = enabled, 1 = low-low 17 gnd gnd ground pin 18 vdd_io pwr power supply for low power differential outputs, nominal 1.05v to 3.3v 19 dif0c_lpr out complement clock of low power differential clock pair. (no 50ohm shunt resistor to gnd needed) 20 dif0t_lpr out true clock of low power differential clock pair. (no 50ohm shunt resistor to gnd needed)
idt tm /ics tm four output differential buffer for pci express 1250a?07/31/07 advance information ICS9DBL411 four output differential buffer for pci express 4 mlf pin description pin # (mlf) pin name pin type description 1 vdda pwr 3.3v power for the analog core 2 gnda gnd ground for the analog core 3oe3# in output enable for dif3 output. control is as follows: 0 = enabled, 1 = low-low 4 dif3c_lpr out complement clock of low power differential clock pair. (no 50ohm shunt resistor to gnd needed) 5 dif3t_lpr out true clock of low power differential clock pair. (no 50ohm shunt resistor to gnd needed) 6 vdd_io pwr power supply for low power differential outputs, nominal 1.05v to 3.3v 7 gnd gnd ground pin 8 dif2c_lpr out complement clock of low power differential clock pair. (no 50ohm shunt resistor to gnd needed) 9 dif2t_lpr out true clock of low power differential clock pair. (no 50ohm shunt resistor to gnd needed) 10 oe2# in output enable for dif2 output. control is as follows: 0 = enabled, 1 = low-low 11 dif1c_lpr out complement clock of low power differential clock pair. (no 50ohm shunt resistor to gnd needed) 12 dif1t_lpr out true clock of low power differential clock pair. (no 50ohm shunt resistor to gnd needed) 13 oe1# in output enable for dif1 output. control is as follows: 0 = enabled, 1 = low-low 14 gnd gnd ground pin 15 vdd_io pwr power supply for low power differential outputs, nominal 1.05v to 3.3v 16 dif0c_lpr out complement clock of low power differential clock pair. (no 50ohm shunt resistor to gnd needed) 17 dif0t_lpr out true clock of low power differential clock pair. (no 50ohm shunt resistor to gnd needed) 18 oe0# in output enable for dif0 output. control is as follows: 0 = enabled, 1 = low-low 19 dif_inc in complement side of differential input clock 20 dif_int in true side of differential input clock
idt tm /ics tm four output differential buffer for pci express 1250a?07/31/07 advance information ICS9DBL411 four output differential buffer for pci express 5 absolute maximum ratings parameter symbol conditions min max units notes maximum supply voltage vddxxx supply voltage 4.6 v 1,7 maximum supply voltage vddxxx_io low-voltage differential i/o supply 0.99 3.8 v 1,7 maximum input voltage v ih 3.3v lvcmos inputs 4.6 v 1,7,8 minimum input voltage v il any input vss - 0.5 v 1,7 storage temperature ts - -65 150 c1,7 input esd protection esd prot human body model 2000 v 1,7 electrical characteristics - input/supply/common output parameters parameter symbol conditions min max units notes ambient operating temp tambient - 0 70 c 1 supply voltage vddxxx supply voltage 3.135 3.465 v 1 supply voltage vdd xxx_io low-volt age differential i/o supply 0.99 3.465 v 1 input high voltage v ihse single-ended inputs 2 v dd + 0.3 v 1 input low voltage v ilse single-ended inputs v ss - 0.3 0.8 v 1 input high voltage v ihdi f differential inputs 600 1.15 v 1 input low voltage v ildi f differential inputs v ss - 0.3 300 v 1 input slew rate - dif_in dv/dt measured differentially 0.4 8 v/ns 2 input leakage current i in v in = v dd , v in = gnd -5 5 ua 1 i dd_3.3v 3.3v supply 25 ma 1 i dd_io+100m vdd_io supply @ fop = 100mhz 15 ma 1 i dd_io_400m vdd_io supply @ fop = 400mhz 54 ma 1 i dd_sb33 3.3v supply, input stopped 25 ma 1 i dd_sbio 0.8v io supply, input stopped 0.1 ma 1 input frequency f i v dd = 3.3 v 33 400 mhz 2 pin inductance l p in 7nh1 c in logic inputs 1.5 5 pf 1 c ou t output pin capacitance 6 pf 1 oe# latency t oe#lat number of clocks to enable or disable output from assertion/deassertion of oe# 1 3 periods 1 tdrive_oe# t droe# output enable after oe# de-assertion 10 ns 1 tfall_oe# t fall 5ns1 trise_oe# t rise 5ns1 operating supply current standby current fall/rise time of oe# inputs input capacitance
idt tm /ics tm four output differential buffer for pci express 1250a?07/31/07 advance information ICS9DBL411 four output differential buffer for pci express 6 ac electrical characteristics - dif low power differential outputs parameter symbol conditions min max units notes rising edge slew rate t slr differential measurement 1 2.5 v/ns 1,2 falling edge slew rate t flr differential measurement 1 2.5 v/ns 1,2 slew rate variation t slvar single-ended measurement 20 % 1 maximum output voltage v high includes overshoot 1150 mv 1 minimum output voltage v low includes undershoot -300 mv 1 differential voltage swing v swing differential measurement 300 mv 1 crossing point voltage v xabs single-ended measurement 300 550 mv 1,3,4 crossing point variation v xabsvar single-ended measurement 140 mv 1,3,5 d cycdis1 dif measurement, fin<=267mhz +5 % 1,6 d cycdis2 dif measurement, fin>267mhz +7 % 1,6 dif jitter - cycle to cycle difj c2c differential measurement, additive 25 ps 1 dif[3:0] skew dif skew differential measurement 50 ps 1 propagation delay t pd input to output delay 2.5 3.5 ns 1 pcie gen2 phase jitter - addtive t phase_addhi 1.5mhz < fin < nyquist (50mhz) 0.8 ps rms 1 pcie gen2 phase jitter - addtive t phase_addlo 10khz < fin < 1.5mhz 0.1 ps rms 1 notes on electrical characteristics: 1 guaranteed by design and characterization, not 100% tested in production. 2 slew rate measured through vswing centered around differential zero 3 vxabs is defined as the voltage where clk = clk# 4 only applies to the differential rising edge (clk rising and clk# falling) duty cycle distortion 8 maximum input voltage is not to exceed maximum vdd 6 tthis is the figure refers to the maximum distortion of the input wave form. 5 defined as the total variation of all crossing voltages of clk rising and clk# falling. matching applies to rising edge rate of clk and falling edge of clk#. it is measured using a +/-75mv window centered on the average cross point where clk meets clk#. 7 operation under these conditions is neither implied, nor guaranteed.
idt tm /ics tm four output differential buffer for pci express 1250a?07/31/07 advance information ICS9DBL411 four output differential buffer for pci express 7 ordering information ics 9dbl411 y glft example: designation for tape and reel packaging lead free, rohs compliant package type g = tssop revision designator (will not correlate with datasheet revision) device type (consists of 3 to 7 digit numbers) ics xxxx y g lf t min max min max a--1.20--.047 a1 0.05 0.15 .002 .006 a2 0.80 1.05 .032 .041 b 0.19 0.30 .007 .012 c 0.09 0.20 .0035 .008 d e e1 4.30 4.50 .169 .177 e l 0.45 0.75 .018 .030 n a 0808 aaa -- 0.10 -- .004 variations min max min max 20 6.40 6.60 .252 .260 10-0035 see variations see variations 0.65 basic reference doc.: jedec publication 95, mo-153 n see variations see variations d mm. d (inch) 20-lead, 4.40 mm. body, 0.65 mm. pitch tssop 6.40 basic 0.252 basic 0.0256 basic common dimensions in millimeters in inches common dimensions (173 mil) (25.6 mil) symbol index area index area 12 1 n d e1 e1 e sea ting plane sea ting plane a1 a a2 e -c- -c- b c l aaa aaa c
idt tm /ics tm four output differential buffer for pci express 1250a?07/31/07 advance information ICS9DBL411 four output differential buffer for pci express 8 top view index area d saw n singulation anvil singulation a 0. 08 c c a3 a1 seat ing plane e2 e2 2 l (n -1)x e (ref.) (ref.) & n n ev e n n e d2 2 d2 (re f.) & od d 1 2 e 2 (typ.) if n & n ar e even (n -1)x (ref.) b th er m al base n or chamfer 4x 0.6 x 0.6 max optional e d n n d d d ordering information ics 9dbl411 y klft example: designation for tape and reel packaging lead free, rohs compliant package type k = mlf revision designator (will not correlate with datasheet revision) device type (consists of 3 to 7 digit numbers) ics xxxx y k lf t dimensions symbol min. max. a0.81.0 a1 0 0.05 n 20 a3 n d 5 b 0.18 0.3 n e 5 e d x e basic 4.00 x 4.00 d2 min. / max. 2.00 / 2.25 e2 min. / max. 2.00 / 2.25 l min. / max. 0.45 / 0.65 ics 20l tolerance symbo l 0.50 basic dimensions 0.20 reference thermally enhanced, very thin, fine pitch quad flat / no lead plastic package
idt tm /ics tm four output differential buffer for pci express 1250a?07/31/07 advance information ICS9DBL411 four output differential buffer for pci express 9 innovate with idt and accelerate your future networks. contact: www.idt.com for sales 800-345-7015 408-284-8200 fax: 408-284-2775 for tech support 408-284-6578 pcclockhelp@idt.com corporate headquarters integrated device technology, inc. 6024 silver creek valley road san jose, ca 95138 united states 800 345 7015 +408 284 8200 (outside u.s.) asia pacific and japan integrated device technology singapore (1997) pte. ltd. reg. no. 199707558g 435 orchard road #20-03 wisma atria singapore 238877 +65 6 887 5505 europe idt europe, limited prime house barnett wood lane leatherhead, surrey united kingdom kt22 7de +44 1372 363 339 ? 2006 integrated device technology, inc. all rights reserved. product specifications subject to change without notice. idt and the idt logo are trademarks of integrated device technology, inc. accelerated thinking is a service mark of integrated device technology, inc. all other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. printed in usa tm revision history rev. issue date description page # 0.1 08/01/06 initial release. - 0.2 09/22/06 updated mlf package dimensions. 8 a 07/31/07 1. updated electrical characteristics - additive jitter, cycle-to-cycle, tpd, skews, slew rates, idd, etc. 2. corrected power grouping table for tssop pkg 3. final release 1,5,6


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